CHAdeMO co-exhibited with 9 member companies this year at eMove360 in Munich during 15 to 17 of October. There were HPCs from Circontrol and DBT-CEV. Fujikura has shown a mock model of CHAdeMO 2.0 Liquid Cooling cable/connector assembly. Also, exciting V2G PCS and power modules were exhibited by AME, eNovates, Magnum CAP, PRE and SCU. There was the famous half-sliced Nissan Leaf in the middle of the booth attracting numerous visitors.