CHAdeMO co-exhibited with 9 member companies this year at eMove360 in Munich during 15 to 17 of October. There were HPCs from Circontrol and DBT-CEV. Fujikura has shown a mock model of CHAdeMO 2.0 Liquid Cooling cable/connector assembly. Also, exciting V2G PCS and power modules were exhibited by AME, eNovates, Magnum CAP, PRE and SCU. There was the famous half-sliced Nissan Leaf in the middle of the booth attracting numerous visitors.
CHAdeMO booth at eMove360 2019 in Munich
This year as almost every year, CHAdeMO exhibited jointly with our members at eMove360 in Munich during 15 to 17 of October.